As the tech world constantly evolves, so does the competition among chipset manufacturers. MediaTek, a renowned name in the industry, has recently unveiled its latest high-end offering, the Dimensity 9300. This chipset is set to go head-to-head with Qualcomm’s newly launched Snapdragon 8 Gen 3 smartphone platform. Let’s dive into the details and discover what makes the Dimensity 9300 stand out.
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MediaTek Dimensity 9300 Specifications
The Dimensity 9300 System-on-Chip (SoC) is the successor to the Dimensity 9200 and is built on third-generation 4nm technology. MediaTek has taken an innovative approach by configuring this chipset with eight cores. It consists of four Arm Cortex-X4 cores, each capable of reaching clock speeds of up to 3.25GHz, and four Cortex-A720 cores with frequencies up to 2.0GHz. Notably, this marks the first instance of “all big cores for extreme performance” in a chipset. In comparison, Qualcomm’s Snapdragon 8 Gen 3 boasts a peak clock speed of 3.3GHz.
MediaTek Dimensity 9300 Vs Dimensity 9200 specs
| Dimensity 9300 | Dimensity 9200 | |
|---|---|---|
| CPU Config | 1x Cortex-X4 @ 3.25GHz 3x Cortex-X4 @ 2.85GHz 4x Cortex-A720 @ 2.0GHz | 1x Cortex-X3 @ 3.05GHz 3x Cortex-A715 @ 2.85GHz 4x Cortex-A510 1.8GHz |
| GPU | Arm Immortalis-G720 12-core Hardware ray-tracing | Arm Immortalis-G715 11-core Hardware ray-tracing |
| Caches | 8MB L3 10MB system-level cache | 8MB L3 6MB system-level cache |
| AI | APU 790 (added INT4 support and hardware compression) | APU 690 |
| RAM support | LPDDR5T @ 9600Mbps | LPDDR5X @ 8333Mbps |
| Storage | UFS 4.0 with MCQ | UFS 4.0 with MCQ |
| 4G/5G Modem | LTE/5G (integrated) Sub6GHz and mmWave 7,900Mbps down | M80-based LTE/5G (integrated) Sub6GHz and mmWave 7,900Mbps down |
| Other networking | Bluetooth 5.X Wi-Fi 7 | Bluetooth 5.3 Wi-Fi 7 Ready |
| Process | TSMC 4nm+ N4P | TSMC 4nm N4P |
Immortalis-G720 GPU
One of the standout features of the Dimensity 9300 is the inclusion of the Immortalis-G720 GPU. This addition results in a remarkable 46% increase in GPU performance while consuming 4% less power. Furthermore, the chipset incorporates hardware-based ray tracing, enabling “console-level global illumination effects at a smooth 60fps.”
APU 790 AI Processor
The Dimensity 9300 also introduces the APU 790 AI processor, which exhibits a significant boost in generative AI performance while being exceptionally power-efficient, consuming up to 45% less power. Additionally, the chipset supports NeuroPilot Fusion, allowing for the utilization of large language models.
Joe Chen, President of MediaTek, expressed his excitement about the Dimensity 9300, stating, “The Dimensity 9300 is MediaTek’s most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design. This distinct architecture, in conjunction with our enhanced on-chip AI Processing Unit, will usher in a new age of generative AI applications as developers push the boundaries of edge AI and hybrid AI computing capabilities.”
Photography Capabilities
For photography enthusiasts, the Dimensity 9300 chipset offers a range of impressive features. These include a low-power AI-ISP, always-on HDR up to 4K resolution, 4K AI Noise Reduction (AI-NR), and AI processing on RAW photographs and videos. The chipset also supports the Android 14 Ultra HDR format. Display options are equally impressive, with support for WQHD at 180Hz and 4K at up to 120Hz. Furthermore, the MiraVision Picture Quality (PQ) engine enhances image quality, ensuring vibrant and sharp visuals.
Connectivity
In the realm of connectivity, the MediaTek Dimensity 9300 chipset leaves no stone unturned. It is equipped with Wi-Fi 7, ensuring lightning-fast and stable wireless connections. Additionally, it features a 5G R16 modem, which promises to provide excellent 5G performance. These features make the Dimensity 9300 an ideal choice for those who demand top-notch connectivity in their smartphones.
Availability
The Dimensity 9300 chipset is set to make its debut on the market with the release of the first MediaTek Dimensity 9300-powered phones by the end of 2023. The Vivo X100 series, featuring this cutting-edge chipset, is scheduled to launch on November 13, offering consumers a glimpse into the future of smartphone technology. Stay tuned for further updates and details about this exciting new addition to the world of mobile technology.
In conclusion, the Dimensity 9300 chipset by MediaTek is poised to be a game-changer in the smartphone industry. With its powerful configuration, advanced AI capabilities, impressive photography features, and state-of-the-art connectivity, it stands as a worthy competitor to Qualcomm’s Snapdragon 8 Gen 3. The future of high-end mobile devices is looking brighter than ever with the introduction of the Dimensity 9300.
